Failure Analysis
V. I. Igoshev and J. I. Kleiman. Creep Phenomena in Lead-Free Solders. Journal of Electronic Materials Vol. 29, No. 02, 2000, pp.244 – 250.
V. I. Igoshev, J. I. Kleiman, D. Shangguan, S. Wong, and U. Michon. Fracture of Sn-3.5%Ag Solder Alloy Under Creep. Journal of Electronic Materials Vol. 29, No. 12, 2000, pp.1356 – 1361.
V. I. Igoshev, J. I. Kleiman, D. Shangguan, C. Lock, S. Wong, and M. Wiseman. Microstructure Changes in Sn-3.5Ag Solder Alloy during Creep. Journal of Electronic Materials, Vol. 27, No. 12, 1998, pp. 1367 – 1371.
