Publications


Failure Analysis


V. I. Igoshev and J. I. Kleiman. Creep Phenomena in Lead-Free Solders. Journal of Electronic Materials Vol. 29, No. 02, 2000, pp.244 – 250.

V. I. Igoshev, J. I. Kleiman, D. Shangguan, S. Wong, and U. Michon. Fracture of Sn-3.5%Ag Solder Alloy Under Creep. Journal of Electronic Materials Vol. 29, No. 12, 2000, pp.1356 – 1361.

V. I. Igoshev, J. I. Kleiman, D. Shangguan, C. Lock, S. Wong, and M. Wiseman. Microstructure Changes in Sn-3.5Ag Solder Alloy during Creep. Journal of Electronic Materials, Vol. 27, No. 12, 1998, pp. 1367 – 1371.

ONTARIO

Headquarters


(905) 415-2207

Toll Free: 1( 855) 415-2207

Fax: (905) 415-3633

info@itlinc.com

LOCATION

Come Say Hi



Headquarter

Units 7-9, 80 Esna Park Dr.

Markham, Ontario
L3R 2R7
Canada






Units 10-11,2650 John Street

Markham, Ontario
L3R 3W1
Canada